Part identity
BY329-1200
Semiconductor Device Diode
Lee Engineering Co Inc
Avg quote: 14 minFulfilled from Anaheim, CAAS9120:2025 · ISO 9001 · FAA AC 00-56BC of C, lot & date code with every line
Part description
Semiconductor Device Diode
ASAP supports this specific part for replacement, spare-pool replenishment, retrofit, and urgent maintenance requirements. Quote requests can include alternate MPN, condition preferences, certification needs, and plant-specific receiving instructions so procurement gets a clear sourcing response before purchase.
Specifications
Certifications & documentation
- UL Recognized
- CE
- C of C available on request
LE
Manufacturer
Lee Engineering Co Inc
Authorized-distributor or qualified-aftermarket source. Parts shipped from this manufacturer include full traceability paperwork and counterfeit-mitigation per SAE AS6081.
View manufacturer profile →Characteristics Data of NSN 5961-01-368-0785, 5961013680785
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| ABHP | OVERALL LENGTH | 15.8 MILLIMETERS MAXIMUM |
| AXGY | MOUNTING METHOD | BRACKET |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 1200.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE, MAXIMUM PEAK TOTAL VALUE |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
