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| Part No. : BAS16 | Manufacturer : fairchild semiconductor corp | Item Name: semiconductor device diode |
| NSN: 5961-01-349-0238 (5961013490238) | CAGE Code: 07263 |
If you require part number BAS16 from Fairchild Semiconductor Corp which is described as a Semiconductor Device Diode component ASAP Logistic Solutions is your sourcing solution. On this page, you can request a quote on part number BAS16 which is listed under the Federal Supply Class . To ensure that you only procure the exact item you need to be sure to note that this particular product is listed with the NSN 5961013490238 and was produced under the CAGE Code 07263. To learn more about this listing or to simply initiate the purchasing process, complete and submit the RFQ form on this page for part BAS16 today Within 15 minutes of receiving and reviewing a completed request based on the information you provide a member of our staff will contact you to provide a tailored solution to your comparison needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-349-0238 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 013490238 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| BAS16 | 1 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 0.1023 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236 |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 PRINTED CIRCUIT |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 75.0 MAXIMUM REVERSE BREAKDOWN VOLTAGE,INSTANTANEOUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES NOMINAL AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| ABHP | OVERALL LENGTH | 0.1197 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.0472 INCHES MAXIMUM |
| CTRD | POWER RATING PER CHARACTERISTIC | 300.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| AXGY | MOUNTING METHOD | TERMINAL |
| MATT | MATERIAL | PLASTIC INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
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