A2H1375 by Fei Microwave Inc With NSN 5961-01-222-8467

Part No. : A2H1375	Manufacturer : fei microwave inc	Item Name: semiconductor device set
NSN: 5961-01-222-8467 (5961012228467)	CAGE Code: 21847	FSC: 5961 Semiconductor Devices and Associated Hardware

If you require part number A2H1375 from Fei Microwave Inc which is described as a Semiconductor Device Set component ASAP Logistic Solutions is your sourcing solution. On this page, you can request a quote on part number A2H1375 which is listed under the Federal Supply Class 5961 Semiconductor Devices and Associated Hardware. To ensure that you only procure the exact item you need to be sure to note that this particular product is listed with the NSN 5961012228467 and was produced under the CAGE Code 21847. To learn more about this listing or to simply initiate the purchasing process, complete and submit the RFQ form on this page for part A2H1375 today Within 15 minutes of receiving and reviewing a completed request based on the information you provide a member of our staff will contact you to provide a tailored solution to your comparison needs.

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NSN Information for Part Number A2H1375 with NSN 5961-01-222-8467, 5961-01-222-8467

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5961-01-222-8467 Item Description: Semiconductor Device Set	5961	012228467	0	N	A
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U			A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
A2h1375	2	1	C			9

Characteristics Data of NSN 5961-01-222-8467, 5961012228467

MRC	Criteria	Characteristic
ABBH	INCLOSURE MATERIAL	GLASS ALL SEMICONDUCTOR DEVICE DIODE
ABHP	OVERALL LENGTH	0.050 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE
ADAV	OVERALL DIAMETER	0.055 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE
ALAS	INTERNAL CONFIGURATION	JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE
ALBA	ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE	COLLECTOR ALL SEMICONDUCTOR DEVICE DIODE
ASCQ	INTERNAL JUNCTION CONFIGURATION	PN ALL SEMICONDUCTOR DEVICE DIODE
ASDD	COMPONENT FUNCTION RELATIONSHIP	MATCHED
ASKA	COMPONENT NAME AND QUANTITY	2 SEMICONDUCTOR DEVICE DIODE
AXGY	MOUNTING METHOD	PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED CASE
CTMZ	SEMICONDUCTOR MATERIAL	SILICON ALL SEMICONDUCTOR DEVICE DIODE
CTQN	VOLTAGE RATING IN VOLTS PER CHARACTERISTIC	-10.0 MAXIMUM FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE
CTQX	CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE
CTRD	POWER RATING PER CHARACTERISTIC	100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
CTSG	MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	125.0 DEG CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE
TTQY	TERMINAL TYPE AND QUANTITY	4 UNINSULATED WIRE LEAD ALL SEMICONDUCTOR DEVICE DIODE

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