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| Part No. : IDT54FCT574EB | Manufacturer : integrated device technology inc | Item Name: microcircuit digital |
| NSN: 5962-01-329-8724 (5962013298724) | CAGE Code: 61772 | FSC: 5962 Microcircuits Electronic |
If you require part number IDT54FCT574EB from Integrated Device Technology Inc which is described as a Microcircuit Digital component ASAP Logistic Solutions is your sourcing solution. On this page, you can request a quote on part number IDT54FCT574EB which is listed under the Federal Supply Class 5962 Microcircuits Electronic. To ensure that you only procure the exact item you need to be sure to note that this particular product is listed with the NSN 5962013298724 and was produced under the CAGE Code 61772. To learn more about this listing or to simply initiate the purchasing process, complete and submit the RFQ form on this page for part IDT54FCT574EB today Within 15 minutes of receiving and reviewing a completed request based on the information you provide a member of our staff will contact you to provide a tailored solution to your comparison needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-329-8724 Item PartTypeName: MICROCIRCUIT,DIGITAL | 5962 | 013298724 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT54FCT574EB | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| CSSL | DESIGN FUNCTION AND QUANTITY | 8 REGISTER,D-TYPE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 11.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND MONOLITHIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | -100.00 MILLIAMPERES MINIMUM OUTPUT SINK AND 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
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