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| Part No. : SM8211 | Manufacturer : national semiconductor corporation | Item Name: microcircuit memory |
| NSN: 5962-00-007-7894 (5962000077894) | CAGE Code: 27014 | FSC: 5962 Microcircuits Electronic |
If you require part number SM8211 from National Semiconductor Corporation which is described as a Microcircuit Memory component ASAP Logistic Solutions is your sourcing solution. On this page, you can request a quote on part number SM8211 which is listed under the Federal Supply Class 5962 Microcircuits Electronic. To ensure that you only procure the exact item you need to be sure to note that this particular product is listed with the NSN 5962000077894 and was produced under the CAGE Code 27014. To learn more about this listing or to simply initiate the purchasing process, complete and submit the RFQ form on this page for part SM8211 today Within 15 minutes of receiving and reviewing a completed request based on the information you provide a member of our staff will contact you to provide a tailored solution to your comparison needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-007-7894 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 000077894 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| SM8211 | 2 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.200 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.525 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/STORAGE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -8.0 VOLTS MINIMUM POWER SOURCE AND 12.3 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 05869-717382-4 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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